高速シリアル通信

規格と技術

今日では、次世代のデジタル・インタフェース規格(シリアル、メモリ、ディスプレイなど)の登場により、最高レベルのコンプライアンス・テストが求められるようになり、ハイスピードTx/Rxの設計では次のような課題に直面しています。

  • デバイスの小型化により信号へのアクセスが困難
  • 新しい省電力技術を採用したバスの動作
  • シグナリング・インタフェースにおける信号の新しいエンコードやイコライゼーション機能の検証
  • 数多くの電気検証試験を短時間で実施する必要性

テクトロニクスは、PHYの検証サイクルを迅速化し再現性を確保するための自動測定ソフトウェアを提供しています。適合性測定に不合格の場合は、プロトコル・デコードやビジュアル・トリガなどのツールを使用することで迅速にデバッグでき、クロストークやその他のマルチレーンの結合ノイズなどのノイズ・ソースに由来するジッタ/ノイズも特定できます。

ライブラリ

Title
PCI Express® Transmitter PLL Testing — A Comparison of Methods

Overview of significant methods for performing PLL Testing

Probing Tips for High Performance Design and Measurement

Learn how to identify common signal integrity problems experienced in high speed and mobile designs, modeling techniques used to study and de-embed the effects of probing, probing considerations for low power circuits and much more in this detailed application note for high performance designs.

High Speed Interface StandardsThis e-Guide will help you learn more about design challenges for testing PCIe 4.0, SAS, SuperSpeed USB, and DDR4 standards. Within the pages of the eGuide you will also get quick access to technical resources that will help you understand design challenges and pick the right solution for your test needs.
Remote Head Acquisition Improves High Speed Serial Measurement

Learn how to maximize the margin in your signal integrity measurements.

Fast+ Efficient Solutions for DVI Conformance Measurement Challenges

Tektronix provides all the DVI measurement solutions you need, ranging from high-bandwidth digital phosphor oscilloscopes (DPO) to probes to application-specific software. Tektronix has solved tough measurement problems like jitter and eye diagram tests to assemble a DVI solution that automates and simplifies your work.

Characterizing an SFP+ Transceiver at the 16G Fibre Channel Rate

Measurements needed to test an SFP+ transceiver to the 16G Fibre Channel standard.

Testing your High Definition embedded devices using the HDMI Version 1.3 specification

Watch this video to get an overview of the new Link Training Tool, which forms…

1:31

Tackle today's high-speed serial signals and tomorrow's too with the scalable…

2:04

Tektronix supports many applications where AWGs are heavily used with plug-ins…

26:01

The Tektronix P7700 TriMode Probe supports solder connections to a device under…

5:58

The NEW P7700 Series TriMode Probe provides the highest probe fidelity available…

0:54

This webinar provides insight into the future of mobile device design and test,…

54:10
Title
Demystify MIPI D-PHY and C-PHY Transmitter and Receiver Physical Layer Test

During this webinar, you'll gain an understanding of MIPI test challenges for both MIPI high-speed physical layers and useful tips and technical insights into characterizing and validating design compliance.

How to Address Your Toughest Serial Bus Design Challenges with EDA and Measurement Correlation

This Tektronix webinar will teach engineers how to use modeling tools to correlate simulations with high-speed physical layer measurements on Serial Bus Standards using the DPO/MSO70000 Series Oscilloscopes.

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