In many cases, achieving the appropriate balance of designing for manufacturability and performance requires the "mixing" of various assembly techniques and technologies. For example, a typical hybrid circuit can be made up of a variety of components, such as active and passive semiconductor devices, assembled together on the same substrate, using a variety of different package and interconnect technologies such as wire bond and flip chip.
Our custom hybrid circuit development team can select the appropriate substrate and interconnect technology, as well as the right mix of active and passive components - in addition to your ICs - to develop a custom hybrid microelectronic solution.
Through our turnkey hybrid circuit design, assembly and test services, Tektronix Component Solutions delivers advanced hybrid devices for use in high performance and high reliability applications. Our advanced design team, experienced in a variety of substrate technologies, ensures that your hybrid circuits are designed with manufacturability and testability in mind. Once the design is complete, or if you have a completed design that you would like us to assemble, Tektronix Component Solutions will manufacture the device in our on-shore, ITAR-registered, lean manufacturing facility, optimized for volumes of 100 - 100,000 parts per year. We can also provide complete electrical and environmental test services to verify the performance and reliability of your hybrid circuit.
SMT Process Capabilities:
If your hybrid circuit requires assembly of active or passive SMT components onto the device, Tektronix Component Solutions can assemble those components within the following:
SMT Component Size (min)
SMT: Adjacent Component Pad Spacing, < 0603 (min)
SMT: Adjacent Component Pad Spacing, > 0603 (min)